Methods of making laminated led array and/or products including the same

ABSTRACT

In certain example embodiments, light emitting diodes (LEDs) may be disposed on a deformable and flexible backbone sheet and chained together in an array, e.g., via flexible wiggle wires. Such flexible wiggle wires may also provide an electrical connection to an external power source. An optical out-coupling layer stack (OCLS) system may help serve as an index matching layer, heat sink, étendue conserver, etc. The backbone may be formed to a shape tailored to its ultimate application. Applications may include, for example, automotive (such as Center High Mounted Stop Lamp (CHMSL) applications), lighting, signage, and/or other applications. In an example CHMSL application, the deformable sheet with the LED array thereon has a step, sinusoidal, or other shape matched to the angle and/or curvature of the glass such that the LEDs produce light primarily in a direction parallel to a surface on which a vehicle is located.

Certain example embodiments relate to light emitting diode (LED)systems, and/or methods of making the same. More particularly, certainexample embodiments relate to laminated LED arrays, products includingsuch laminated LED arrays, and/or methods of making the same. In certainexample embodiments, LEDs may be disposed on a flexible backbone sheetand chained together in an array. The backbone may be formed to a shapetailored to its ultimate application.

BACKGROUND AND SUMMARY OF EXAMPLE EMBODIMENTS OF THE INVENTION

Light emitting diodes (LEDs) have emerged as a technology used ingeneral illumination, display, signage and other applications. Therehave been some attempts to improve luminous efficacy, CRI matching, andlifetimes, although there remains room for yet further improvements.Furthermore, challenges still exist when it comes to providingcost-effective techniques for integrating the active materials intodevice packages, interconnecting them into modules, managing theaccumulation of heat during their operation, spatially directing andhomogenizing their light output at desired levels of chromaticity andintensity, etc.

Some current commercial implementations make use of sophisticated,high-speed tools that are based on conceptually old procedures thatexploit robotic systems to assemble material mechanically diced from asource wafer, with collections of bulk wires, lenses, and heat sinks inmillimeter-scale packages, on a device-by-device basis, followed byseparate steps to form arrays of the LEDs on rigid printed circuitboards (PCBs). However, these solutions tend to be proprietary andtailored to specific applications.

Thus, it will be appreciated that there is a need in the art forimproved LED-inclusive devices, and/or methods of making the same. Forexample, there is a need in the art for improved LED-inclusive devices,and/or methods of making the same, where LED-inclusive subassemblies canbe incorporated into a wide variety of different applications wheredifferent structural and performance requirements must be met and/orwhere conventional interconnections might otherwise be difficult.

In certain example embodiments of this invention, a window for avehicle. First and second glass substrates are laminated to one anothervia a first laminating material. A deformable backbone supports aplurality of LED devices, with the deformable backbone being disposedbetween the first and second substrates, and with the LED devices beingconnected to one another via flexible wires. The backbone has a shapeselected to match an angle at which the windshield is to be disposed inthe vehicle and so that the LED devices, when powered, emit lightprimarily in a direction parallel to a surface on which the vehicle islocated.

In certain example embodiments of this invention, an electronic device.A flexible sheet supports a plurality of a bare die LEDs. The LEDs areconnected to one another via flexible wires to form an LED array. TheLEDs in the array are individually addressable and powerable viaremotely located control circuitry. An optical out-coupling layer stack(OCLS) system is disposed over the LEDs, with the OCLS system comprisingan isotropic layer matrix including an organo-metallic chelate hybridmaterial and a matrix core including dispersed scatterers. The flexiblesheet is deformed, with the LED array thereon, such that is shaped tomatch a desired application.

In certain example embodiments of this invention, a method of making awindow for a vehicle is provided. A deformable backbone supporting aplurality of LED devices is provided, with the LED devices beingconnected to one another via flexible wires. The deformable backbonewith the LED devices thereon is positioned between first and secondglass substrates. The first and second substrates are laminated togetherwith the deformable backbone therebetween. The backbone, when laminatedbetween first and second substrates, has a shape selected to match anangle at which the windshield is to be disposed in the vehicle and sothat the LED devices, when powered, emit light primarily in a directionparallel to a surface on which the vehicle is located.

In certain example embodiments of this invention, a method of making anelectronic device is provided. A flexible sheet supporting a pluralityof a bare die LEDs is provided, with the LEDs being connected to oneanother via flexible wires to form an LED array, and with the LEDs inthe array being individually addressable and powerable via remotelylocated control circuitry. An optical out-coupling layer stack (OCLS)system is disposed over the LEDs, with the OCLS system comprising anisotropic layer matrix including an organo-metallic chelate hybridmaterial and a matrix core including dispersed scatterers. The flexiblesheet is deformed, with the LED array thereon, such that is shaped tomatch a desired application.

The features, aspects, advantages, and example embodiments describedherein may be combined in any suitable combination or sub-combination torealize yet further embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features and advantages will be better and morecompletely understood by reference to the following detailed descriptionof exemplary illustrative embodiments in conjunction with the drawings,of which:

FIG. 1 shows a polyimide base supporting component islands and helpingto protect the straight tracks and soldered joints from strains, inaccordance with certain example embodiments;

FIG. 2A is an image of a stretchable and flexible mesh including atwo-dimensional array of LEDs placed in a passive matrix that isselectively addressable, in accordance with certain example embodiments;

FIG. 2B is a schematic view of the FIG. 2A mesh;

FIG. 3 is a cross-sectional view of a backlite in an area proximate tothe Center High Mounted Stop Lamp (CHMSL) and through a sectionincluding LEDs, in accordance with certain example embodiments;

FIG. 4 is a flowchart illustrating one example technique for forming aCHMSL in accordance with an example embodiment;

FIG. 5 is a flowchart illustrating another example technique for forminga CHMSL in accordance with an example embodiment;

FIG. 6 shows an LED mounted on a semi-flexible board with wiggle wiresextending therefrom, which may be used in connection with certainexample embodiments;

FIGS. 7A-7B show how LEDs of this sort may be connected in an array inaccordance with certain example embodiments;

FIGS. 8A-8I are thermal management simulations that have been performedin connection with certain example embodiments;

FIG. 9 is an electronic device that includes as energy harvester andpower management electronics to make for an autonomous system inaccordance with certain example embodiments; and

FIGS. 10A-10B demonstrate example patterning techniques that may be usedin connection with certain example embodiments.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS OF THE INVENTION

Certain example embodiments relate to techniques for incorporating LEDdevices into lighting modules that manage light conversion, extractionand distribution in ways that (i) allow packaging in unique form-factorssuch as complex multi-axial bends, (ii) reduce adverse effects relatedto heat build-up during operation, (iii) wavelength convert and improvelight out-coupling efficiencies, and/or (iv) distribute light indesirable spatial orientations. This is accomplished in certain exampleembodiments by decoupling LED devices into its various componentsincluding, for example, (i) bare dice, (ii) phosphors, and (iii) opticalelement arrays and out-coupling scatterers.

The above-described and/or other problems could be solved, in part, byprovided stretchable LED array based circuits that can conform to theshape of a substrate or superstrate and can be readily deformable, whilestill maintaining their functionality. Such assemblies could be usefulin a variety of applications, including those that involve electroniccomponents distributed over a comparatively large area such as, forexample, displays and discrete LEDs used in signage applications, sensorarrays, etc. Thus, certain example embodiments involve a mesh ofelectronics components with the following example attributes:

-   -   Simple flexibility implies single or uni-axial bends (so as to        provide, e.g., cylindrical and/or conical shapes).    -   Flexibility as well as stretchability implies complex or        multi-axial bends and/or arbitrary shapes, if the conducting        interconnects are also stretchable.    -   The mesh is patternable into islands. Electrical components may        be distributed on small islands of a PCB (that may, for example,        include heat sinks and thus allow the meshes to be in close        proximity to or in contact with a supporting glass substrate).    -   Combinability with stretchable optics, which may help allow for        the embedding of optical fibers and polydimethylsiloxane (PDMS)        and/or other stretchable optical waveguides in stretchable        substrates (e.g., for artificial skin, pressure-touch, shear,        and/or other sensor applications).    -   Various domains of the above can be interconnected with        transparent conductive coating (TCC) interconnects (which may be        transparent conductive oxides or TCOs, or the like) or        potentially pre-patterned bus bars on the glass. Conductive inks        of or including silver and/or carbon may be used in conjunction        with low temperature solders, at least with respect to the        later.    -   The mesh may be laminated between two sheets of glass using PVB,        EVA, or any laminable medium.    -   The laminated foil or substrate may be provided with        three-dimensional relief structures or embossed with a view of        directing the active components in certain desirable        orientations about a certain axis.    -   The mesh may include a laminable flexible solar cell (e.g., a        CIGS, c-Si, and/or other based solar cell, optionally on a metal        foil), and a thin battery. The solar cell may charge the        battery, which is electronically regulated to power the active        components (e.g., in connection with LEDs used in signage        applications). In such instances, the device may be free from        external leads and/or power connections and, as a result, may be        a part of an autonomous system.

Thus, certain example embodiments may include a flexible circuitincluding small islands of rigid small distributed PCBs, withstretchable interconnects. The islands themselves may be either rigid orsemi-flexible and may include electrical components (e.g., passiveand/or active electrical components such as, for example, diodes,regulator chips, antennas, energy transformer elements, etc). Wigglewire technology may be used in the design of stretchable,highly-reliable interconnects. The whole unit may be encapsulated orcladded in a strain-allowing material such as, for example, PDMS, othersilicones, and/or other suitable materials.

Referring now more particularly to the accompanying drawings in whichlike reference numerals indicate like parts throughout the severalviews, FIG. 1 shows a polyimide base 102 supporting component islands104 and helping to protect the straight tracks and soldered joints 106from strains, in accordance with certain example embodiments. That is,the polyimide base 102 may, for example, help support stretchable copperconductors, while wiggle wires 108 enable component and meander support.

FIG. 2A is an image of a stretchable and flexible mesh including atwo-dimensional array of LEDs placed in a passive matrix that isselectively addressable, in accordance with certain example embodiments,and FIG. 2B is a schematic view of the FIG. 2A mesh. In the FIG. 2Aexample, a power connection is provided at the periphery of thesubstrate, and signals are carried via a suitable TCO provided to theflexible carrier material. As will be appreciated by those skilled inthe art, the mesh material may be laminated between glass and/orplastics. Sequenced addressing of select rows and/or columns may be usedin applications such as, for example, signage, low resolution display,and/or the like.

One possible application for the techniques described above relates toautomotive applications where the substrates are curved glass substratesand, more particularly, relates to the using an LED array in connectionwith a Center High Mounted Stop Lamp (CHMSL) in a rear windshield orbacklite. Because of the inclination of the backlite, the luminous fluxof an LED array would be not be optimized in the direction parallel tothe road. That is, because LEDs are generally point light sources, thelight may be directed upward, away from the direction parallel to theroad, and at an angle generally matching the inclination of thebacklite. One possible way to address this issue would be to increasethe number of LEDs to match the desired or specified radiance in thedirection of road. However, this solution is not efficient. By contrast,redirecting the light using conventional secondary non-imaging opticsmay be performed in connection with a gap, but the gap usually will needto be thicker that the thickness of the windshield or backlite.

The inventor of the present disclosure has realized, however, that theuse of conformable stretchable circuits and structures, or embossing ofthe PVP or glass itself, may allow light to be redirected in the mostefficient manner. In this regard, FIG. 3 is a cross-sectional view of abacklite in an area proximate to the CHMSL and through a sectionincluding LEDs, in accordance with certain example embodiments. FIG. 3includes inner and outer glass substrates sandwiched together via apolymer-inclusive interlayer 306, which may be PVB, EVA, or any othersuitable material. LEDs 308, which are provided on a flexible backbone310, are strung together and interconnected as a part of an array. TheLEDs may have leads coming out of each other to facilitate connectionsto each other and/or connections to a power source. The backbone 310itself may be bent or otherwise shaped into a step-like pattern thatmatches the inclination of the backlite, e.g., so as to facilitate lightfrom the LEDs 308 being directed outward and in a direction that issubstantially parallel to the road. An optional optical matchingmaterial 312 is provided in the stepped areas. This optical material 312may be an optical out-coupling matrix material that optionally includesa light scattering matrix. This helps create a lens effect, e.g., withsubstantially collimated light bundles with smaller angular distributionat the exit of the lens. In certain example embodiments, the angulardistribution is preferably 1-50 degrees, more preferably 4-40 degrees,and most preferably 10-30 degrees. The lens material may include PMMA,as I can be cast with a very high optical surface finish and has areduced susceptibility to the common yellowing problem experienced byother materials after exposure to UV.

The example CHMSL shown in FIG. 3 can be fabricated in a number ofdifferent ways. For instance, FIG. 4 is a flowchart illustrating oneexample technique for forming a CHMSL in accordance with an exampleembodiment. The material typically used for the polymer-inclusiveinterlayer in windshields (e.g., PVB, EVA, or the like) can be cuttransversely in a potentially stepped or terraced manner, giving rise totwo pieces of that material with jagged and matching faces (step S402).As an alternative, producing the multi-stepped wedge of PVB or otherlaminating material may be accomplished by extruding or othertechniques, although this may be difficult to accomplish in connectionwith a molten polymer. A flexible circuit supporting micro-LEDs will beaffixed to one of the pieces such that it conforms to the terracedsurfaces (step S404). The flexible circuit may be booked between the twomating sheets (step S406). This sub-assembly may be laminated betweentwo glass sheets (step S408).

It will be appreciated that other shapes may be used in lieu of thestepped or terraced shape of the polymer-based wedge. For example, asubstantially sinusoidal cross-section of the PVB or EVA interlayer maybe used in connection with certain example embodiments. Angle tolerancesfor non-imaging applications generally will not be as stringent as forimaging applications (including, for example, head-up display or HUDapplications). Generally, angles may be controlled in tenth of radianstolerances, e.g., such that a target angle does not deviate by more than1 radian.

The wedge's stepped surface or angle(s) allows the backlite to re-directthe LED light towards the line of sight of drivers following behind. Ifcoated with antireflective (AR) and/or a light out-coupling layer oreven etched, the backlite may perform as an optical combiner,essentially combining reflections off outer and inner backlite glasssurfaces and redirecting the light out towards the viewer.

FIG. 5 is a flowchart illustrating another example technique for forminga CHMSL in accordance with an example embodiment. A suitable backbone isprovided in step S502. The backbone may be polymer-based in certainexample embodiments and, in this regard, may be of or include PET,polyimide, polyamide, PMMA, etc. LEDs are disposed on the backbone in adesired pattern in step S504. An optical out-coupling layer stack (OCLS)system may be coated over the LEDs, or applied as a sheet thereon, instep S506. The backbone may be bent into shape in step S508. In stepS510, the shaped backbone with the LEDs thereon may be laminated betweenlaminating materials (which may be of or include PVB, EVA, or othersuitable material), before or when the glass sheets bonded together. Forinstance, in certain example embodiments, a shaped backbone with LEDsprovided thereon may be laminated, and the laminated sub-assembly may besandwiched between the glass substrates (thereby effectively involvingmultiple separate laminating steps). In certain other exampleembodiments, the backbone may be sandwiched between the substrates, andthe substrates may be laminated together with the backbone therebetweenin a single step.

To achieve an improved (and potentially optimum) geometry as well asphysical dimensions, non-imaging techniques may be used to tailorsurfaces that transform the light distribution of the LED. Thus, instill another approach, in certain example embodiments, a simple cubic,hexagonal, or other shaped array of holes of potentially varyingdiameter(s) or major distances can be drilled into a laminating material(e.g., of or including PVB, EVA, or the like). An inner parabolicsurface may be created and potentially coated with a reflective coating.For example, a mirror may be created using the wet process of silvermirroring. The mirror may be surface protected with a clear lacquercoating. The base glass may thus (i) provide the surface to create anarray of compound parabolic concentration (CPC) holes, (ii) house theLED fully packaged or bare die PCB with optional ancillary heat sinks,(iii) house the lens, (iv) allow another glass plate carrying a phosphorto be remotely spaced far away from the LED, and/or perform otherfunctions. See, for example, U.S. application Ser. No. 13/188,916, filedJul. 22, 2011, the entire contents of which are hereby incorporatedherein by reference. The '916 application describes how CPCs can beformed, e.g., to conserve the étendue of the light source; how a remotephosphor plate may be used with a Fresnel lens to provide increaseddiffusion and/or homogenization of emitted light; how mirror coatingsmay be formed and/or protected; etc. As is known, étendue refers to howspread out light is in a given medium over a given area and a solidangle. This difference may be up to, and sometimes over, a factor of 30in conventional arrangements, and this difference might otherwisesometimes create barriers to achieving increased luminance on a targetthat is a given distance away from the plane of the light source. Forexample, a typical light source or lamp may only operate to collect 50%of the light emitted from the source.

Wiggle wires extending from the LEDs may extend to a power source. Incertain example embodiments, this may be accomplished by disposing theLEDs and wiggle wires on a plot of silver-inclusive and/or otherconductive ink. The wiggle wires may extend through the laminatingmaterial that protects the backbone (if any), e.g., to connect with thepower source. In certain example embodiments, the wiggle wires may be inelectrical communication with the power source via a conductive coatingprovided to one of the substrates. For instance, low-E coatings (whichin some cases multilayer thin film silver-based layer stacks) may bedisposed on one or more of the substrates. Because such low-E coatingsgenerally are conductive, they may be used to power the LEDs. Othertransparent conductive coatings (TCCs) may be used to power the LEDs,regardless of whether they arc low-E coatings, in certain exampleembodiments.

Moreover, in certain example embodiments, the low-E or other conductivecoatings may be patterned, e.g., to allow for remote program logic(potentially operating under the control of a processor, the vehicle'sLIN bus, etc.) to control whether the lights should be activated, howthey should be activated, etc. For instance, in certain exampleembodiments, a suitable hardware, software, and/or firmware controllermay be used to cause the CHMSL to respond to breaking actions in knownmanners, to cause the light to change from color-to-color (or to shadesof a single color) as breaking is taking place and potentially inproportion to how “hard” the driver is breaking, to cause messages to bedisplayed, etc.

FIG. 6 shows an LED mounted on a semi-flexible board with wiggle wiresextending therefrom, which may be used in connection with certainexample embodiments. FIGS. 7A and 7B show how LEDs of this sort may beconnected in an array in accordance with certain example embodiments.That is, FIGS. 7A-7B show a simple bare die LED array that is mountableon a semi-flexible board, with a serpentine-like interconnected mesh, inaccordance with certain example embodiments.

As alluded to above, tailored profiles may be used to accuratelytransform the light of the source. But étendue efficiency is often onlyone of the consideration in the design of a collection lens. Thepresence of total internal reflection (TIR) at the reflecting surface,the need for or possibility to benefit from an antireflective coating,etc. can influence the usability of the devices of certain exampleembodiments.

Thermal considerations related to heat load also are a potentialconcern. In this regard, FIGS. 8A-8I are thermal management simulationsthat have been performed in connection with certain example embodiments.More particularly, FIGS. 8A-8D show temperature distributions forisolated InGaN μ-ILEDs with Al interconnects [300 nm and 1,000 nm thickfor FIGS. 8A-8B and FIGS. 8C-8D), respectively] at input powers of 7.8mW in FIG. 8A, 16.4 mW in FIG. 8B, 8.4 mW in FIG. 8C, and 18.0 mW inFIG. 8D, captured using a QFI Infra-Scope Micro-Thermal Imager (left)and calculated by analytical models (right). FIG. 8E shows the surfacetemperature for μ-ILEDs with Al interconnect thicknesses of 300 nm(darker line) and 1,000 nm (lighter line), extracted from experiments(dots), and computed using the analytical model (lines) as a function ofinput power. The input power used in FIG. 8E was 40 mW for each LED.FIG. 8F is a three-dimensional plot of the surface temperature asfunction of device size and interconnect thickness, at a constant heatflux of 400 W/cm². A preferred operation area is the encircled area,although other operation areas are usable in connection with differentexample embodiments. FIG. 8G shows the temperature distribution for amacro-sized LED (in this case, 1×1 mm²), and FIG. 8H shows thetemperature distribution for an array of 100 μ-ILEDs (in this case,100×100 μm²) at a spacing of 2 mm. FIG. 8I shows μ-ILEDs surfacetemperature vs. spacing for an array of 100 μ-ILEDs. The FIG. 8I graphis significant because it relates the surface temperature to ILEDspacing. The maximum temperature of certain example embodimentspreferably is less than 200 degrees C., more preferably below 175degrees C., and most preferably below 100-140 degrees C. This is becauseefficiency drops as temperature increase. This implies a spacing of lessthan 500 μm, more preferably less than 400 μm, and still more preferablybetween about 200-375 μm.

FIG. 9 is an electronic device that includes as energy harvester andpower management electronics to make for an autonomous system inaccordance with certain example embodiments. The FIG. 9 device may beused in a wide variety of lighting applications, including vehiclelighting, signage, overhead or outdoor lighting, etc. As implied fromFIG. 9, the stretchable LED matrix 900 may be deformed or otherwiseincluded in a curved or planar embodiment. A driver chip 902 provided toa power management module 904 controls the functioning of individualLEDs in the LED matrix 900. The power management module 904 may receiveand modulate power from one or more solar cells 906 or the like. Abattery or the like (not shown) may be provided to store power generatedby the solar cells 906, in certain example embodiments.

As alluded to above, one example application involves including a solarpanel in a backlite or sunroof of an automobile. The solar module maysupply enough power to run and charge a thin-film battery under ambientlighting conditions (e.g., greater than or equal to about 300 lux). Thesolar panel may run in parallel with a 5.6V zener over-voltageprotection diode directly into a power management IC. As is known, azener diode allows current to flow in the forward direction in the samemanner as an ideal diode, but will also permit it to flow in the reversedirection when the voltage is above a certain value known as thebreakdown voltage (the so-called zener voltage). The power IC mayprovide its outputs into a startup delay circuit to allow time for thesolar panel to begin the charging process of an empty battery. The lowquiescent current regulator (e.g., a TPS78033 module available fromTexas Instruments) may help to keep the voltage passed from the solarpanel in the operating voltage range needed to power a sensor or anarray of LEDs.

Patterning techniques may be used, for example, to pattern a conductivematerial disposed on the glass (e.g., a silver-inclusive material, anITO-based layer, etc.) and/or form interconnects. Laser ablation, e.g.,using a pulsed excimer laser or the like, is one technique that may beused in connection with certain example embodiments. FIGS. 10A-10Bdemonstrate example patterning techniques that may be used in connectionwith certain example embodiments. More particularly, FIG. 10A shows aLIFT technique, which involves laser-induced transfer of metal or otherconductive portion 1002 a from a layer of transfer material 1002 on anadjacent carrier glass or other substrate 1004 onto the receiving glassor other substrate 1006. The laser beam is focused through appropriateoptics 1008 a for accomplishing same. FIG. 10B shows the LIBT variant,in which a laser beam is irradiated through both suitable optics 1008 band the acceptor substrate 1006 to cause migration of the metal or otherconductive portion 1002 a from the layer of transfer material 1002 onadjacent carrier substrate 1004. Following such patterning, the LEDs canbe connected by soldering (e.g., with a soldering iron) or any othersuitable technique. The laser can also be used to make repairs when thearray is partially or fully completed.

Although excimer lasers are mentioned above, other types of lasers canbe used including, for example, YVO₄, YAH, Ti-sapphire, CO₂, and/orother lasers. As an example, suitable powers generally may be in therange of 10-20 W, Q-switched pulse frequencies may be in the range of20-200 kHz, and the actual pulse width may be in the range of 100-140ns. These example parameters allowed for quick processing and goodmechanical/flexural durability. Higher power outputs (e.g., up to about30 W) may allow for patterning to be performed on a potentially widerrange of materials, with high speed marking (e.g., up to about 12,000mm/s). The MD-F3000 model commercially available from Keyence, forinstance, may be suitable for scribing ITO, CNT, silver bus bars, and/orother materials to link the LEDs to one another and/or to otherdata/power lines. Operating this apparatus at 70% power, with a scanspeed of 1,000 mm/s at a frequency of 120 kHz and at a line width of0.08 mm yielded good results, although other process parameters and/orequipment are of course possible in different implementations.

It is noted that the typical passenger car has an orientation of about60 degrees (and oftentimes about 58 degrees). It will be appreciatedthat in certain example embodiments, the light output drop-off relativeto the maximum output in certain example embodiments preferably is lessthan 25%, more preferably less than 15%, and even more preferably lessthan 10%, at angles up to 50 degrees off of normal. It also will beappreciated that in certain example embodiments, the light outputincrease relative to a situation where no redirection is employed atangles between about 40-60 degrees from normal is preferably at leastabout 25%, more preferably at least about 40%, and sometimes around 50%or even higher.

As indicated above, an OCLS system may help improve the outputefficiency and heat sinking abilities of the assemblies. An OCLS mayhelp to provide an index matching layer between the glass and LEDs,e.g., to help increase the light otherwise coupled into the glass.Mie-like scattering caused by the OCLS may help to frustrate thewave-guiding modes in the glass, e.g., by breaking down the in-phasecoherence. In a related manner, Mie-like forward scattering may beincreased, even with reduced spectral dispersion.

For example, Γ_(i)(Ω, k) can be defined as the photon flux incident tothe glass surface, and Γ_(o)(Ω,k) can be defined as the output flux inair, where the symbols Ω and k are solid angle and wave vector,respectively. The ratio is now boosted by a factor η_(iml)×η_(s) (Ω, k),where η is the index matching efficiency of the OCLS matrix/adjacentplanarizer and where η_(s) is the scattering efficiency. The total fluxoutput can the be calculated by computing the double integral ∫∫Γ_(i)(Ω,k)η_(iml)×η_(s)(Ω, k)dΩdk over the entire phase space. However, based onthis model, one can see that the necessary condition is that the productη_(iml)×η_(s)>1. Certain example embodiments described below demonstratehow this regime can be implemented.

The OCLS may be a multilayer system in certain example embodiments, withits functionality being based at least in part on how its variouscomponents are optimized so as to achieve the desired performance. Incertain example embodiments, the OCLS may include a thick isotropiclayer matrix, with a matrix layer core that includes dispersed sphericalscatterers, and an optional planarization layer. Each of thesecomponents is discussed in greater detail, below.

As indicated above, the OCLS may include a thick isotropic layer matrix,e.g., located between the glass and the LEDs. This layer may include anorgano-metallic chelate hybrid with a high refractive index, preferablygreater than 1.7, more preferably of 1.8-1.9, and potentially evenhigher in some cases. The absorption coefficient may be near zero insome cases. The chemistry of the matrix layer is described in, forexample, U.S. Publication No. 2012/0088319, the entire contents of whichare hereby incorporated herein by reference.

As the '319 publication describes, certain example embodiments mayinvolve hybrid coating systems based on polymeric titanium dioxideand/or polymeric zirconia, based systems. The organic-inorganic hybridpolymer solution is prepared by first reacting the titanium alkoxidewith a chelating agent to convert the highly reactive tetra-coordinatetitanium species to a less reactive hexa-coordinate species. Otherdesired polymer components may then be added to the stabilized titaniumcontaining solution and thoroughly mixed. As a result of thestabilization, the hybrid polymer solution may be stable at roomtemperature up to 6 months with negligible change in color andviscosity. The hybrid polymer solution may be spin-coated or verticalslot coated onto substrates to a desired thickness.

A titanium dioxide rich film was generated by thermally decomposing thehybrid coatings at an elevated temperature of less than about 250degrees C. The resulting dried films may be made as thin as 0.2 um andup to about 4 um or more. Such films may have good transparency and haverefractive indices as high or higher than about 1.90 in the entirevisible region when the cure temperature was 300 degrees C. or higher. Acrack-free film over 300 nm in thickness was obtained with a singlecoating application. Multiple-coating is applicable to obtain a thickerfilm, and no apparent interface was seen from SEM cross-section imagesbetween two consecutive coatings. The hybrid high refractive index filmsare mechanically robust, stable upon exposure to both heat and UVradiation, and may be applicable for a wide variety of opticalapplications. The material is compatible with semiconducting material.

In certain example embodiments, the organic-inorganic hybrid polymer maybe introduced into a laminable medium such as ethylene-vinyl acetate(EVA), silicones, aramids, etc. This would then allow the use of vacuumbonding or de-airing, sometimes without the use of autoclave.

The organic polymers chosen contained multiple hydroxy functionalities.They were so chosen to allow primary or secondary chemical bondingbetween the polymer and the titanium dioxide phase to promote phasecompatibility and a high degree of dispersion. The chelated poly(dibutyltitanate) polymer and the organic polymer are compatible in all orsubstantially all proportions, both in solution and in the cured film,as evidenced by their high transparency and the refractive indexdispersion curves. Typically, an index as high as or higher than 1.9 isobtained at 550 nm for a thickness of 0.4 um. When deposited on anyinorganic light emitting diode, even a film as thin as 0.4 micronsdramatically improves the light out-coupling from the high refractiveindex material significantly typically in the incremental range of 70%.

An inorganic-based precursor is provided. In certain exampleembodiments, the inorganic-based precursor may be a titanium-basedprecursor such as, for example, titanium alkoxide, a titanium-basedphosphate complex, etc. The inorganic-based precursor may be depositeddirectly or indirectly on the device and/or substrate to be coated. Forinstance, in certain example embodiments, a titanium alkoxide basedprecursor may be deposited via atomic layer deposition (ALD), atitanium-based phosphate layer may be printed, etc. Of course, it willbe appreciated that other high-index inorganic materials may be used inplace of or in addition to the titanium in certain example embodiments.

A chelate may be formed, and an organic component may be added, togetherwith optional additives. The chelate in certain example instances may besalicylic acid. The organic component in certain example embodiments maybe a resin, silicone, polyimide, polyamide, and/or the like. Optionaladditives also may be introduced. For instance, other inorganicmaterials (e.g., in place of or in addition to the titanium-basedprecursor) may be introduced to tune the index of refraction. Indeed,the index of refraction may be adjusted upwardly or downwardly byselective inclusion of zirconia, silica and/or silicates, etc. Lightscattering elements and/or heat dissipating elements also may beintroduced. One example material that functions both as a lighterscattering agent and a heat dissipater is boron nitride. Plasticizersalso may be included in certain example embodiments.

The chelated titanium-based precursor and the organic component(s) maybe cross-linked to create an organic-inorganic hybrid solution. In oneexample, titanium alkoxide may be reacted with a chelating agent toconvert the tetra-coordinate Ti species into a less reactivehexa-coordinate species, e.g., to create chelated poly(dibutyltitanate). Of course, other titanates may be created and/or used indifferent embodiments of this invention. The hybrid polymer may resultin certain example instances by mixing together the chelatedpoly(dibutyl titanate) with a hydroxy inclusive organic resin. Incertain example embodiments, the organic and inorganic components may beprovided in equal percentages by weight. In certain example embodiments,the organic and inorganic components may be provided in a ratio of 60/40by weight. Of course, other ratios and/or percentages are possible indifferent embodiments of this invention.

The hybrid solution may be quite liquidous in certain exampleembodiments. In such a case, the hybrid solution may be wet applied,vertical slot meniscus coated, or otherwise provided to a desiredthickness. Example coating techniques are described in, for example,U.S. Pat. No. 6,383,571, the entire contents of which are herebyincorporated herein by reference. In certain example embodiments,however, it may be desirable to provide a more viscous hybrid laminate(e.g., inorganic and/or other materials included in an organic bindersuch as EVA, silicones, aramids, etc.) that can be extruded, forexample. A more viscous hybrid laminate may be advantageous in terms ofa “cleaner” or “less messy” application.

The coated hybrid polymer or laminate is dried and/or cured. The dryingand/or curing may help to remove solvents and water, leaving moreinorganic material than organic material in certain example embodiments.The drying may take place at a first elevated temperature of less thanabout 250 degrees C., whereas the curing may take place at a secondelevated temperature of greater than or equal to about 300 degrees C.Certain example embodiments may include one or both of drying and curingat these and/or any other suitable temperature.

Thus, in summarizing these example basic formulation, cross-linking, andcuring steps, it will be appreciated that a chelated Ti-based precursoris brought into contact with a resin binder; the resin binder and thechelated Ti-based precursor are cross-linked; the solvent is evaporatedthrough a heating process, and the cured film is adhered to a substrate(e.g., a film, hard surface, glass, etc.). In so doing, either (a) theorganic-inorganic hybrid solution is wet applied on the substrate overthe at least one LED, or (b) the organic-inorganic hybrid solution isintroduced into a carrier medium and then the carrier medium is extrudedonto the substrate over the at least one LED. The organic-inorganichybrid solution is cured once disposed on the substrate, e.g., informing the coating.

The rheological property of the matrix preferably is such that it can bedispensed either by zone casting or a slot meniscus coating over largeareas of glass, and rapidly cured, e.g., by heat and/or UV exposure.When cured, it may help to effectively index match to the light emittinglayers. In some cases, this portion of the OCLS may be 10-100 um inthickness. The smoothness of this layer preferably is on the order ofthe smoothness of glass and has an RMS roughness of less than or equalto 1.0 nm and more preferably of less than or equal to about 0.5 nm.

One of the routes for the matrix implementation is the use of glassypolymeric monomer to which titanium, hafnium, and/or zirconiumoxo-clusters are added. When polymerization of the monomer is done inthe presence of 10-30% by weight of Zr₄O₂(OMc)₁₂, for example, a clearand high index film is produced with high flexural strength andextremely good adhesion to the glass substrate. The use of anappropriate surfactant and coupling agent may assist in slot dispensinguniformity. The organic surface of Ti₁₆O₁₆(OEt)₃₂ cluster can beselectively modified by alcoholysis. This gives rise to new functionalclusters, Ti₁₆O₁₆(OEt)₃₂-x(OR)x, where R can be a methacrylate orstyrene and x is the number of modified alkoxy ranging anywhere from 4to 16 depending, for example, on the pH.

The resulting matrix thus combines advantages of polymers (e.g.,processability, flexural strength, etc.) and those of inorganic buildingblocks (such as, for example, high refractive index in the case of thetransition alkaloids and chemical inertness, thermal and environmentalstability, etc.). The index matching layer (imL) alone has goodout-coupling efficiencies for incidence angles near zero and is alsoangle dependent.

The matrix layer core may include generally spherical scatterers thatpreferably are dispensed in such a manner that they are not clumpedtogether. The Zeta potential of the scatterer colloid used preferably ishigh for good stability of the system, and sometimes is even greaterthan 70 mV. As is known, the Zeta potential refers to electro-kineticpotential in colloidal systems. Zeta potential is the potentialdifference between the dispersion medium and the stationary layer offluid attached to the dispersed particle. Those skilled in the artgenerally consider a value of 25 mV as the value that separateslow-charged surfaces from highly-charged surfaces. It is noted that theZeta potential value sometimes is related to the stability of thecolloidal dispersion, e.g., such that high values indicate greaterstability, etc. These values also help ensures that the scattererfilling density is in a range of values such that the spheres aremono-dispersed with an inter-particle distance d of about 3sphere-diameters (or 6r). If this condition is met, then theirseparation is sufficiently large so that contribution of secondary wavesto the field exciting each particle is much smaller that the externalfield.

As will be appreciated from the above, in certain example scenarios, theindex matching out-coupling efficiency (>1) is boosted by a Mie-likescattering efficiency greater than one. The matrix containing thescatterers is itself a high index inorganic chelate. The scatterers areprepared, e.g., so that they comprise one or more materials. Forinstance, scatterers may have a concentric composition that increasesscattering in some cases. The relative refractive index m, size r, andconcentration of the scatterers (1/s³) are chosen so that they helpimprove total integrated light out-coupled from the devices.

Although certain example embodiments have been described in connectionwith inorganic LEDs (ILEDS), it will be appreciated that the techniquesdescribed herein may be used in connection with other types of lightemitting diodes including, for example, organic light emitting diodes(OLEDs), polymer light emitting diodes (PLEDs), and/or other lightingsystems, etc.

Further details regarding OCLS systems can be found in, for example,U.S. application Ser. No. 13/488,779, filed on Jun. 5, 2012, which ishereby incorporated herein by reference.

It will be appreciated from the above that certain example embodimentsrelate to a laminable and conformable medium that carries electroniccomponents, including LEDs. The topology of the circuit includes adistributed mixture of rigid and flexible parts, packaging, andinterconnections. In the case of LEDs for lighting or signage, such acircuitry arrangement allows for molded elastic circuits capable ofbeing deployed over relatively large areas of planar or curved glass. Ofcourse, the techniques disclosed herein may be used in connection withother applications including, for example, applications that use LEDs aspotential replacements for existing infrastructures in lighting systemsused in residential, commercial, as well as mobile systems; display orsignage devices; etc.

Glass substrates are advantageous for several reasons. For example, thescratch resistance and flexural strength of glass, coupled with itsability to be chemically tempered and have an optical surface finishthat is able to sustain a silver mirror over long periods of operationis an advantage (e.g., over some plastic materials). Glass generally isnot susceptible to yellowing from UV and can sustain high operationaltemperature for phosphor coating heat treatment for crystallization. Theexpansion coefficient of glass is also mush less than most plastics andconsequently bonding of the PCB to the glass can be done with a hightolerance to expansion effects for a large array, such as may beinvolved in a luminaire or the like.

It is noted that the glass substrates of certain example embodiments maybe chemically and/or thermally strengthened or tempered, e.g., to meetsafety codes. The terms “heat treatment” and “heat treating” as usedherein mean heating the article to a temperature sufficient to achievethermal tempering and/or heat strengthening of the glass inclusivearticle. This definition includes, for example, heating a coated articlein an oven or furnace at a temperature of at least about 550 degrees C.,more preferably at least about 580 degrees C., more preferably at leastabout 600 degrees C., more preferably at least about 620 degrees C., andmost preferably at least about 650 degrees C. for a sufficient period toallow tempering and/or heat strengthening. This may be for at leastabout two minutes, or up to about 10 minutes, in certain exampleembodiments.

As used herein, the terms “on,” “supported by,” and the like should notbe interpreted to mean that two elements are directly adjacent to oneanother unless explicitly stated. In other words, a first layer may besaid to be “on” or “supported by” a second layer, even if there are oneor more layers there between.

Certain example embodiments relate to a method of making a window for avehicle. A deformable backbone supporting a plurality of LED devices isprovided, with the LED devices being connected to one another viaflexible wires. The deformable backbone with the LED devices thereon ispositioned between first and second glass substrates. The first andsecond substrates are laminated together with the deformable backbonetherebetween. The backbone, when laminated between first and secondsubstrates, has a shape selected to match an angle at which thewindshield is to be disposed in the vehicle and so that the LED devices,when powered, emit light primarily in a direction parallel to a surfaceon which the vehicle is located.

In addition to the features of the previous paragraph, in certainexample embodiments, the plurality of LED devices may be provided as apart of a Center High Mounted Stop Lamp (CHMSL), the CHMSL beingcontrollable by a controller remote the LED devices.

In addition to the features of either of the two previous paragraphs, incertain example embodiments, the first laminating material may comprisePVB.

In addition to the features of any of the three previous paragraphs, incertain example embodiments, the backbone may be formed from PET,polyimide, polyamide, and/or PMMA.

In addition to the features of any of the four previous paragraphs, incertain example embodiments, the backbone may shaped so as to have aplurality of steps, with each said step supporting at least one of saidLED devices. In some such cases, the backbone may be formed by cutting asingle sheet of laminating material into complementary first and secondstepped portions. In addition to the features of any of the fourprevious paragraphs, in certain example embodiments, the backbone mayhave a substantially sinusoidal shape.

In addition to the features of any of the five previous paragraphs, incertain example embodiments, an optical out-coupling layer stack (OCLS)system may be provided over the LED devices, with the OCLS systemoptionally comprising an isotropic layer matrix including anorgano-metallic chelate hybrid material and a matrix core includingdispersed scatterers.

In addition to the features of the previous paragraph, in certainexample embodiments, the dispersed scatterers may have a Mie-likescattering efficiency of greater than 1, potentially leading to an indexmatching out-coupling efficiency for the OCLS of greater than 1.

In addition to the features of either of the two previous paragraphs, incertain example embodiments, a filling density of the scatterers may bein a range of values such that the scatterers are mono-dispersed with aninter-particle distance d of about 3 diameters or major distances.

In addition to the features of the previous paragraph, in certainexample embodiments, each scatterer may be located in the far field ofits nearest neighbor and there may be no systematic phase relationship,except potentially for coherent exact forward scattering.

In addition to the features of any of the nine previous paragraphs, incertain example embodiments, a multilayer low-emissivity (low-E) coatingmay be disposed on the first and/or second substrate.

In addition to the features of the previous paragraph, in certainexample embodiments, the LED devices may be chained together to form anarray; at least some leads may extend from the array and may be indirect electrical contact with the low-E coating; and the LED devicesmay be addressable and/or powerable via the low-E coating.

In addition to the features of any of the 11 previous paragraphs, incertain example embodiments, the LED devices may be chained together toform an array that operates at a temperature of no greater than 150degrees C.

Certain example embodiments relate to a method of making an electronicdevice. A flexible sheet supporting a plurality of a bare die LEDs isprovided, with the LEDs being connected to one another via flexiblewires to form an LED array, and with the LEDs in the array beingindividually addressable and powerable via remotely located controlcircuitry. An optical out-coupling layer stack (OCLS) system is disposedover the LEDs, with the OCLS system comprising an isotropic layer matrixincluding an organo-metallic chelate hybrid material and a matrix coreincluding dispersed scatterers. The flexible sheet is deformed, with theLED array thereon, such that is shaped to match a desired application.

In addition to the features of the previous paragraph, in certainexample embodiments, the flexible sheet may be formed from PET,polyimide, polyamide, and/or PMMA.

In addition to the features of either of the two previous paragraphs, incertain example embodiments, the flexible sheet may be shaped so as tohave a plurality of steps, with each said step supporting at least oneof said LEDs. In addition to the features of either of the two previousparagraphs, in certain example embodiments, the flexible sheet may beshaped so as to have a substantially sinusoidal shape.

In addition to the features of any of the three previous paragraphs, incertain example embodiments, the flexible sheet may be shaped byproviding a single stratum of laminating material, and cutting thesingle stratum of laminating material into first and secondcomplementary pieces, the first piece having a desired pattern.

In addition to the features of any of the four previous paragraphs, incertain example embodiments, the flexible sheet with the LED arraythereon may be embedded in a laminating material.

In addition to the features of the previous paragraph, in certainexample embodiments, a plurality of cavities may be formed in thelaminating material, with each said LED potentially being oriented in arespective cavity, and with each said cavity potentially being taperedalong a depth thereof so as to increase in diameter or distance from afirst end thereof wherein the respective LED is located to a second endthereof.

In addition to the features of the previous paragraph, in certainexample embodiments, each said cavity may have a parabolic side wallwhen viewed in cross section.

In addition to the features of either of the two previous paragraphs, incertain example embodiments, each said cavity may have a reflectivecoating disposed thereon.

In addition to the features of the previous paragraph, in certainexample embodiments, the reflective coating may comprise a thin filmlayer including silver and an optional protective layer disposed on thethin film layer including silver.

In addition to the features of any of the four previous paragraphs, incertain example embodiments, light exiting the second end of each saidcavity may be substantially collimated so as to allow for only 10-30degrees of distribution.

While the invention has been described in connection with what ispresently considered to be the most practical and preferred embodiment,it is to be understood that the invention is not to be limited to thedisclosed embodiment, but on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims.)

1-14. (canceled)
 15. A method of making an electronic device, the methodcomprising: providing a flexible sheet supporting a plurality of a baredie LEDs, the LEDs being connected to one another via flexible wires toform an LED array, the LEDs in the array being individually addressableand powerable via remotely located control circuitry; and disposing anoptical out-coupling layer stack (OCLS) system over the LEDs, the OCLSsystem comprising an isotropic layer matrix including an organo-metallicchelate hybrid material and a matrix core including dispersedscatterers, wherein the flexible sheet is deformed, with the LED arraythereon, such that is shaped to match a desired application.
 16. Themethod of claim 15, wherein the flexible sheet is formed from PET,polyimide, polyamide, and/or PMMA.
 17. The method of claim 15, furthercomprising shaping the flexible sheet so as to have a plurality ofsteps, each said step supporting at least one of said LEDs.
 18. Themethod of claim 15, further comprising shaping the flexible sheet so asto have a substantially sinusoidal shape.
 19. The method of claim 15,wherein the flexible sheet is shaped by providing a single stratum oflaminating material, and cutting the single stratum of laminatingmaterial into first and second complementary pieces, the first piecehaving a desired pattern.
 20. The method of claim 15, wherein theflexible sheet with the LED array thereon is embedded in a laminatingmaterial.
 21. The method of claim 20, wherein a plurality of cavitiesare formed in the laminating material, each said LED being oriented in arespective cavity, each said cavity being tapered along a depth thereofso as to increase in diameter or distance from a first end thereofwherein the respective LED is located to a second end thereof.
 22. Themethod of claim 21, wherein each said cavity has a parabolic side wallwhen viewed in cross section.
 23. The method of claim 21, wherein eachsaid cavity has a reflective coating disposed thereon.
 24. The method ofclaim 23, wherein the reflective coating comprises a thin film layerincluding silver and a protective layer disposed on the thin film layerincluding silver.
 25. The method of claim 23, wherein light exiting thesecond end of each said cavity is substantially collimated so as toallow for only 10-30 degrees of distribution.
 26. A method of making avehicle including a window, the method comprising: providing a windowincluding first and second substrates that have been laminated togetherwith a deformable backbone therebetween, the deformable backbonesupporting a plurality of LED devices, the LED devices being connectedto one another via flexible wires; wherein the backbone, when laminatedbetween first and second substrates, has a shape selected to match anangle at which the window is to be disposed in the vehicle and so thatthe LED devices, when powered, emit light primarily in a directionparallel to a surface on which the vehicle is located; and installingthe window in the vehicle in making the vehicle, wherein the window is arear windshield of the vehicle.